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Sirius 1 solder paste Sn62 Pb Ag2

No-Clean solder paste suitable for stencil printing in reflow processes.
Fine pitch capability (400 μm).
High activity.
Minimal residue, neutral and colourless.
Chlorine-free.

MBO Paste Lead solder, +179°C Melting Point, 36% Lead, 62% Tin, 2% Silver, 30g 

 

 Percent Lead36%
 Product FormPaste
 Melting Point+179°C
 Percent Silver2%
 Percent Tin                                            62%
 Flux TypeRosin
 Product Weight30g
 Flux Content Percent14%