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AUTOFIL A11 Sn60Pb38Cu activated solder wire

Activated No-Clean solder alloy with incorporated resinous flux.
Designed for industrial applications in the electronics and connector industries.
Excellent wetting on tin-plated substrates.
Generates minimal fumes and residue.
Chlorine content: 1.1 %
Class: J-STD-004 ROM1

MBO 1.2mm Wire Lead solder, +183 → +190°C Melting Point, 38% Lead, 2% Copper, 60% Tin, 500g 

 

 Wire Diameter1.2mm
 Model NumberSN60 PB CU2
 Percent Lead38%
 Product FormWire
 Melting Point+183 → +190°C
 Percent Tin60%
 Flux Type                                               Rosin
 Product Weight500g
 Flux Content Percent2%
 Percent Copper2%